In microsystems, the size effect of surface area plays a dominant role under certain conditions. To this end, we designed a curved spring, a slider, and a spring-loaded silicon micro-mechanical structure to study the micro-tribology problem. It is hoped that the effect of the size effect of the microstructure will be studied by changing the relationship between the area of ​​the slider and the feature scale. We process this microstructure using a bulk silicon process. The silicon microstructure formed by etching the silicon is bonded to the substrate by a bonding process. On the bonding surface of the glass, there is a layer of plating film to achieve electrostatic and electrical signal transmission requirements. Because the influence of the corner is to be considered, the deflection and the corner of each key point (the right-angled corner in the structure) must be calculated, and the joint deformation caused by the joint is the final total displacement. Silicon Microstructure The main idea of ​​this structural design is to study the effect of the area effect on the friction by changing the nominal contact area between the micro-slider and the glass base; applying an electrostatic force between the micro-slider and the glass base to change the micro The distance between the slider and the glass base to study the effect of the spacing effect on the friction. The pulling and pressing forces are applied to the pull ring through the probe, and the pulling spring acts on the slider and the bending spring to measure the amount of change in the displacement, so that the frictional force can be indirectly measured. Analysis of the microstructure of the curved spring-micro-slider-tension spring, static analysis of the bending spring In this structure, the width of the curved spring is h, the length is l, and the two bending springs are connected in parallel.
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